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Electronic Packaging Heat Sink Material Market: Growth Trajectory and Forecast Analysis (2024-2032)

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The electronic packaging heat sink material market is poised for steady growth as the demand for efficient thermal management solutions rises across industries such as consumer electronics, automotive, telecommunications, and industrial equipment. Valued at USD 15.23 billion in 2023, the market is projected to grow to USD 29.8 billion by 2032, registering a compound annual growth rate (CAGR) of 7.74%.